Huawei's brand new Kirin chip set have already entered the indian market with their flagship smartphone series honour. Right from the 16nm manufacturing process to the improved architecture, latest graphics engine and support for next-gen wireless connectivity and LTE networks these chipsets are launched by company to provide tough fight to MediaTek and Qualcomm that happen to be two of the biggest players in the mobile SoC space, and have been vying to win market share in markets worldwide.
With tagline of " DARE TO PERFORM" lets see how does the Kirin 650 compare to the current generation of SoCs from Qualcomm and Mediatek?
Faster, cooler and a power efficient chip: All- new Kirin 650 chipset with flagship FinFET Plus 16 nm chip technology offers lightning-fast performance compared with previous-generation 28 nm chipsets
Optimized big.LITTLE Architecture: Huawei Kirin 650 delivers best of both worlds in terms of performance and efficiency. Four 2.0 GHz high-performance cores, and four 1.7 GHz lower-performance cores work their magic by approaching tasks in the most optimized manner. Lighter tasks are assigned to lower clocked cores, ensuring maximum power efficiency along with speed. While heavy tasks are handled by the high
performance cores, ensuring power-on-tap for demanding tasks like gaming, rendering, etc
The Mali 830 GPU on the Kirin 650 SoC offers comprehensive support for current and next generation APIs, enabling advanced 3D graphics acceleration and GPU Compute functionality. This includes support for the Khronos OpenGL ES 3.2*, 3.1/2.0/1.1, Vulkan 1.0* and OpenCL 1.1/1.2* Full Profile APIs. Additionally support is provided for the Android Extension Pack, Android Renderscript and Microsoft Windows DirectX11 FL9_3.
Power efficiency: Built on advanced 16nm manufacturing process, Kirin 650 allows for multiple reductions in energy loss while being able to push the clock speed of the cores higher. The Kirin 650 also comes with silicon-chip level protection. There is a dedicated security module within the silicon chip that ensures user security, handling key information like fingerprints, keypad, and voice.
The 16nm FinFET advantage: 16 nm FinFET technology is a flagship class manufacturing process usually reserved for top level SoCs, the Apple A9 and Kirin 950 use 16nm FinFET manufacturing process. Kirin 650 is the only SoC among the competing midrange SoC that uses 16nm FinFET technology. Among mid-range silicon chips, Qualcom's Snapdragon 650 and 652 processors continue to use 28 nm technology, while MediaTek's SoC fall in the 20 to 28 nm. The Kirin 650, although positioned as a mid-range SOC, actually employs 16 nm FinFET Plus technology, making it two generations ahead of the competition due to its greatly improved performance and reduced power consumption.
Superior Network Reception: Flagship-grade dual antennas system support on the Kirin 650 SoC automatically switches to the antenna with the best signal to prevent dropped calls.
To know actual and real performances of any phone or chipset its the best to compare them using benchmark test .
Snapdragon 616 octa-core processor alongside MediaTek MT6752 and Kirin 620 are the mid-range processors in the market. All three mobile processors are octa-core processor and support 64-bit capabilities. Well. Let’s take a look at the benchmark scores comparison between Snapdragon 616/615,and Hisilicon’s Kirin 620.
CPU Performance
Vellamo 2 Metal measures the CPU subsystem performance of mobile processors. Metal 3 is the latest version of Vellamo’s CPU benchmark. Geekbench 3.0 is Primate Labs cross-platform processor benchmark which simulates real-world scenarios and gives a combined score, based on the results of integer, floating point and memory performance.
SoC vellamo 2 vellamo3 geekbench3
Qualcomm Snapdragon 615 (Alcatel OneTouch Idol 3) 801 1066 2006
HiSilicon Kirin 620 (Huawei P8lite) 765 (-4%) 1076 (+1%) 2805(+40%)
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